合肥高志电子科技有限公司

 

Bergquist GapPad2500S20超低压力应用间隙填充导热材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

GapPad2500S20可供规格：

厚度(Thickness)：0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm4.06mm 5.08mm 6.35mm

片材(Sheet)：8”×16”（203×406 mm）8.4”×19”(213.36×482.6mm)

卷材(Roll)：无

 导热系数(Thermal Conductivity)：2.4W/m-k

 基材(Reinfrcement Carrier)：玻璃纤维

胶面(Glue)：双面自带粘性

颜色(Color)：浅黄色

包装(Pack)：美国原装进口包装

抗击穿电压(Dielectic Breakdown Voltage)（Vac）:＞3000

持续使用温度（Continous Use Temp）：-60°~200°

 GapPad2500S20特点和好处

Gap Pad 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K.The material is a
filled-polymer material yielding extremely soft, elastic characteristics.The material is reinforced to provide easy handling, converting, added electrical isolation and tear resistance. Gap Pad 2500S20 is well suited for lowpressure applications that typically use fixed standoff or clip mounting.The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
Gap Pad 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. It is also available with a non-tack side. Please see the “Standard Options” section for description. The material is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.

GapPad2500S20技术优势分析：

GapPad2500S20是额定热传导率为2.4W/mK增强的导热材料。这种材料由超柔软的填充聚合物构成，增强了易加工性，转换性，电气绝缘性和抗撕裂性。这种材料被典型的用做螺丝固定或者夹子固定的低紧固压力的应用，它的弹性特性和贴服性能决定了其优良的界面润湿特性，从而保持高度粗糙的或者平整界面一致。GapPad2500S20在装配的过程中两边用螺丝钉自然固定，从而固定其位置。材料的两边都有保护衬垫保护。

GapPad2500S20典型应用

处理器和散热器之间、图形芯片和散热器之间、硬盘，DVD，CDROM电子冷却、需要传热的框架，底盘或者其它需要热转移的区域。

销售公司：合肥高志电子科技有限公司

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